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August 8, 2008 1:36 PM

It is important to us that we provide our customers with quality services and products. Below is a list of the testing services that we outsource with approved testing labs.

For further information contact one of our Sales Reps:

Sales Department:
Phone: 818.718.4100
Fax: 818.718.4044
sales@stock-point.com

OutSourced Testing Services - NOT PERFORMED IN-HOUSE
  • Acceleration
  • Helium Leak Testing on Components
  • Atmosphere/Altitude to 80,000 ft.
  • HAST Testing
  • Barometric Pressure Testing
  • Humidity Test
  • Bond Pull
  • Immersion
  • Burn-in Testing to +200 Deg C
  • Industrial Temperature Testing
  • Capacitance Testing
  • Lead Forming
  • Centrifuge
  • Marking
  • Class S Testing for Space
  • Non-Destructive Testing
  • Clean Room Microelectronic Packaging
  • PIND Particle Impact Noise Detection
  • Commercial Testing
  • Qualification Testing
  • Cross Sectioning
  • Recertification
  • Custom Hardware/Software
  • Reliability Testing
  • Custom IC & Transistor Packaging
  • Power Burn-In
  • Destructive Testing
  • Radiography
  • Die Qualification
  • Resistance to Solvents
  • Die Shear Strength Test up to 5.0 Kg
  • SEM Analysis - Scanning Electron Microscope
  • Destructive Physical Analysis - DPA on Components
  • Salt Spray
  • Dust Testing
  • Serialize Components
  • EDAX
  • Shock Testing
  • Electrical Characteristics
  • Solderability Testing
  • Electrical Testing:
    • High Voltage
    • High Current
  • Space Level Testing
  • Element Evaluation
  • Temperature Cycling (-200°C to +200°C)
  • Environmental Stress Screening
  • Thermal Shock Testing (+200°C)
  • Environmental Testing
  • Up screening
  • Equivalent screening for JAN thru JANS
  • Vibration Testing - Up to 500 lb.
  • Failure Analysis
  • Wafer Probing
  • Fine & Gross Leak Testing
  • X-Ray
  • Fungus Test
Types of Electronic Components Tested
  • DC to DC Converters 
  • Digital ICs  
  • Diodes 
  • Capacitors  
  • Custom
  • ASICs  
  • FETs  
  • Fuses 
  • Integrated Circuits
  • Laser Pen/Laser Light Testing 
  • Linear ICs
  • LED Testing
  • Memory Chips / Modules
  • Microprocessors
  • Optics
  • Rectifiers
  • Bridges
  • Relays
  • Resistors
  • Switches
  • SCR's
  • Transistors
  • Triacs
MIL-STD-883 Tests
  • Bond Strength - 2011
  • Burn-in - 2025
  • Constant Acceleration/Centrifuge - 2001
  • Die Shear - 2019
  • Die Penetrant - 1034
  • External Visual - 2009
  • Internal Visual, Hybrid - 2017
  • Internal Visual inspection for DPA - 2013
  • Internal Visual Mechanical - 2014
  • Internal Visual Monolithic - 2010
  • Lead integrity - 2004
  • Lead Pull for PG - 2028
  • Lid Torque - 2024
  • MecMoisture Resistance - 1004
  • Mechanical Shock - 2002
  • Non-destructive Bond Pull - 2023
  • Physical Dimensions - 2016
  • PIND-Particle Impact Noise Detection - 2020
  • Qualification and Quantity Conformance Inspection - 5005
  • Resistance to Solvents - 2015
  • Salt Atmosphere - 1009
  • Screening - 5004
  • Seal - Leak Test - 1014
  • Solderability - 2003
  • Stabilization Bake - 1008
  • Steady State Life - 1005
  • Temperature Cycling - 1010
  • Thermal Shock - 1011
  • Vibration Variable Frequency - 2007

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Stock-Point Electronics, Inc.
9576 Topanga Canyon Blvd. | Chatsworth, CA 91311
Phone:  818.718.4100 | Fax:  818.718.4044
e-mail: customerservice@stock-point.com

Copyright © 2000-2008 All Rights Reserved Stock Point Electronics, Inc. Copying or saving of any content or web pages is strictly prohibited.

Stock-Point Electronics, Inc. is an Independent Distributor and is not affiliated with the manufacturers of the products it sells, except as expressly noted otherwise.
Any and all trademark rights associated with the manufacturers' names and products are owned by the respective manufacturers.

Related Terms: Obsolete Semiconductor, Electronic Component Supplier, Electronic Component Distributor, Obsolete Integrated Circuit, Obsolete Electronic Component

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